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Keyword：Angel Round Financing
Shenzhen Superconduct Technologies Co., Ltd. Completes Angel Round Financing
According to Qichacha information, on September 18, 2026, second-generation high-temperature superconducting material R&D and manufacturer Shenzhen Superconduct Technologies Co., Ltd. (hereinafter referred to as Superconduct) completed an angel round of financing, with the investor being Shenzhen Yijun Technology Co., Ltd. The financing amount has not yet been disclosed. Superconduct was established in September 2022 and is a high-tech enterprise focusing on the R&D and preparation of second-generation high-temperature superconducting YBCO (yttrium barium copper oxide) tapes. The company's technical team is led by an academician and was the first globally to master double-sided YBCO thin-film tape preparation technology. It is the only enterprise in the Guangdong-Hong Kong-Macao Greater Bay Area engaged in the industrialization of high-performance second-generation high-temperature superconducting YBCO tapes. High-temperature superconducting tapes are regarded as a controllable...
2026-09-20
Wuke Superconducting Completes Tens of Millions in Angel Round Financing, Accelerating the Industrialization of High-Temperature Superconducting Tapes
In late July 2026, Beijing Wuke Superconducting Technology Co., Ltd. (hereinafter referred to as "Wuke Superconducting") completed an angel round financing of tens of millions of RMB. This round was jointly invested by CASSTAR, Zhongguancun Capital, and Huairou Hard Technology Fund. The joint backing of several renowned venture capital institutions fully confirms the capital market's high recognition of Wuke Superconducting's core team, technical strength, and industry development prospects. Wuke Superconducting was initiated by the technical team of the Institute of Physics, Chinese Academy of Sciences, focusing on the R&D, preparation, and industrial application of a new generation of high-temperature superconducting tapes. The company is dedicated to overcoming the key bottlenecks in transitioning high-temperature superconducting materials from laboratory to large-scale application, building an integrated platform covering superconducting target development, core equipment R&D, high-performance tape preparation, and ultimate performance characterization of wires and tapes.
2026-08-03